System and method for dicing semiconductor components

ABSTRACT

A method and system for dicing semiconductor components, such as bare dice and chip scale packages, are provided. Initially, the semiconductor components are contained on a wafer or a panel. Next, an insert that includes a base and an adhesive layer, is used to support the substrate for separation into separate components by sawing or other process. The insert with the separated components retained thereon, is then transferred to a carrier tray constructed according to JEDEC standards. The carrier tray is adapted for stacking and for handling by conveyors, magazines and other standard equipment. The system includes the substrate, the insert, and the standardized carrier tray.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09,110,226filed Jul. 6, 1998, U.S. Pat. No. 6,136,137.

FIELD OF THE INVENTION

This invention relates generally semiconductor manufacture andparticularly to a system and method for icing semiconductor components,such as bare dice and chip scale packages.

BACKGROUND OF THE INVENTION

Semiconductor components are typically manufactured using wafer levelfabrication processes. Semiconductor dice, for example, are fabricatedby subjecting silicon wafers to well known processes. Following thefabrication process, the dice must be separated into individual units.The separation process is sometimes referred to as “dicing”. Dicing istypically accomplished by cutting the wafer with a saw blade, anetchant, a liquid jet stream, or a laser beam.

With a conventional dicing process, the wafer can be mounted to asupport member known as a “film frame”. The film frame includes a frame,and an elastomeric adhesive film stretched across the frame. Theadhesive film secures the wafer to the frame, and maintains the dice ina stationary position for dicing.

Semiconductor dice can also be packaged using wafer level processes. Forexample, one type of package, known as a chip scale package, can befabricated while the dice are still contained on the wafer. U.S. Pat.Nos. 5,685,885 and 5,682,061 to Khandros et al. disclose representativewafer level fabrication processes for chip scale packages. Following thepackaging process, the wafers are diced to separate the chip scalepackages into individual units.

With either bare dice or chip scale packages, the separated componentscan subsequently be transferred to a carrier adapted to hold multiplecomponents. The carriers are used to transport the components forfurther processing, such as testing, and for assembling the componentsto circuit boards and electronic devices.

One type of carrier used widely in the industry, is manufactured byVichem Corporation, of Sunnyvale, Calif. under the trademark “GEL-PAK”.These carriers include a plastic frame and an elastomeric membraneformulated to provide a releasable adhesive surface for the separatecomponents. Representative elastomeric membrane materials includesilicone, polyurethane, thermoplastic elastomers and polyimide. Theelastomeric membrane can accommodate various components having differentsizes and shapes.

Typically, the frames for this type of carrier can be stacked forenclosing and protecting the components. In addition, the frames canhave a “standard” peripheral configuration, and “standard” features thatpermit handling by standard equipment, such as magazines and conveyortracks. The standard features can include lugs, recesses, chamfers andother features formed integrally with the frame. One type of standardcarrier is constructed according to JEDEC (Joint Electron DeviceEngineering Council) standards, and is known as a JEDEC tray.

One aspect of these carriers is that the components are typically placedinto the carriers one component at a time. For example with waferdicing, a pick and place vacuum mechanism can be used to individuallyremove each die from a film frame for placement in the carrier.Individual loading of components into carriers can be time consuming,and subjects the components to additional handling. It would beadvantageous for a dicing system to transfer diced components intocarriers in groups, rather than individually.

Further, although an external configuration of a carrier may bestandardized, an internal configuration of the carrier is typicallyadapted for use with only one type of component. For example, somecarriers include individual compartments sized for a particular type ofcomponent. It would be advantageous for a carrier to have the capabilityto handle different types and sizes of components.

The present invention is directed to a system for dicing semiconductorcomponents in which multiple diced components can be placed in a carrierof the system at the same time. In addition, an external configurationof a carrier tray of the system is standardized, and an internalconfiguration can accommodate different types of components.

SUMMARY OF THE INVENTION

In accordance with the present invention, an improved method and systemfor dicing semiconductor components are provided. For performing themethod, a substrate containing multiple semiconductor components isprovided. In the illustrative embodiment the components are chip scalepackages fabricated on a wafer, such as silicon, or on a panel, such asa glass filled resin. Alternately the method can be performed using baresemiconductor dice contained on a silicon wafer.

The method includes the steps of: providing an insert having an adhesivelayer for retaining the substrate; separating the substrate intoseparate components using the insert; and then mounting the insert withthe separated components thereon to a carrier tray with a standardperipheral configuration and features. Separation of the substrate canbe accomplished using a conventional dicing technique such as sawcutting, liquid jetting, laser machining, or etching the substrate.Mounting of the insert to the carrier tray can be manual, or can be withvacuum handlers, or other automated equipment.

The system includes the substrate, the insert and the carrier tray. Theinsert includes a base with the adhesive layer formed thereon. Theadhesive layer can comprise an elastomeric material, a pressuresensitive tape, or a vacuum actuated membrane. The carrier tray includesclip members and retention members for retaining one or more insertsthereon. In addition, the carrier tray has a peripheral configurationand external features constructed according to standards of an industrystandard setting body, such as JEDEC. Standardized equipment, such asmagazines and conveyor tracks, can thus be used for transporting andhandling the carrier tray, with the inserts and diced componentsretained thereon. Still further, the carrier tray includes stackingridges that permit stacking of multiple carriers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a system for dicing semiconductorcomponents constructed in accordance with the invention;

FIG. 2 is an enlarged plan view of a substrate containing multiplesemiconductor components prior to dicing in accordance with theinvention;

FIG. 2A is an enlarged cross sectional view taken along section line2A—2A of FIG. 2 illustrating a separated or diced semiconductorcomponent;

FIG. 3A is a schematic cross sectional view of the substrate attached toan insert of the system prior to dicing;

FIG. 3B is a schematic cross sectional view of the substrate and insertduring dicing of the components from the substrate;

FIG. 3C is a schematic cross sectional view of the substrate and insertfollowing dicing;

FIG. 4A is a plan view of an alternate embodiment vacuum actuatedinsert;

FIG. 4B is an enlarged cross sectional view taken along section line4B—4B of FIG. 4A;

FIG. 4C is an enlarged cross sectional view equivalent to FIG. 4B duringapplication of a vacuum to release separated components from the vacuumactuated insert;

FIG. 4D is an enlarged cross sectional view equivalent to a portion ofFIG. 4B showing an alternate embodiment membrane support structure inthe form of a woven material;

FIG. 5 is a plan view of the insert and separated components placed on atray of the system;

FIG. 5A is a cross sectional view taken along section line 5A—5A of FIG.5;

FIG. 5B is a cross sectional view taken along section line 5B—5B of FIG.5;

FIG. 6 is a plan view of a carrier tray constructed in accordance withthe invention;

FIG. 7 is a side elevation view of the carrier tray;

FIG. 8 is an end elevation view of the carrier tray taken along sectionline 8—8 of FIG. 6;

FIG. 9 is a schematic side elevation view of stacked carrier trays;

FIG. 10 is a cross sectional view taken along section line 10—10 of FIG.6; and

FIG. 11 is a block diagram illustrating broad steps in the method of theinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As used herein, the term “dicing” refers to separation of a substrateinto a plurality of separate components.

Referring to FIG. 1, a system 10 constructed in accordance with theinvention is illustrated. The system 10 includes a substrate 12containing multiple semiconductor components 14. The system 10 alsoincludes an insert 16 adapted to support the substrate 12 for dicinginto separate components 14, and to retain the separated components 14.The system 10 also includes a carrier tray 18 adapted to carry, ortransport, multiple inserts 16 with the separated components 14 thereon.

Referring to FIGS. 2 and 2A, the substrate 12 and components 14 areillustrated. In the illustrative embodiment, the substrate 12 comprisessilicon and the components 14 comprise chip scale packages. Thesubstrate 12 and components 14 can be fabricated as disclosed in U.S.Pat. No. 5,674,785 entitled “Method Of Producing A Single Piece PackageFor Semiconductor Die”, and in U.S. Pat. No. 5,739,585 entitled “SinglePiece Package For Semiconductor Die”. Both of the these patents areincorporated herein by reference.

Alternately, the substrate 12 can comprise a glass filled resin (e.g.,FR-4). Still further, the substrate 12 can comprise a silicon or galliumarsenide wafer, and the components 14 can comprise bare semiconductordice.

FIG. 2A illustrates the component 14 following separation from thesubstrate 12. The component 14 includes a silicon package body 20 and asemiconductor die 22. The package body 20 includes a pattern of planarcontacts 24 and a matching pattern of ball contacts 26 formed onopposing surfaces thereof. The ball contacts 26 can comprise solderballs arranged in a dense array, such as a ball grid array (BGA), andare adapted for electrical connection to contacts on a mating electricaldevice, such as a printed circuit board or module substrate. The planarcontacts 24 and ball contacts 26 are electrically interconnected byconductive vias 28 in the package body 20. In addition, the ballcontacts 26 and planar contacts 24 have a mating configuration whichpermits multiple components 14 to be stacked to one another.

The component 14 also includes a die mounting cavity 30 wherein the die22 is mounted face side down, and a wire bonding cavity 32 wherein wires34 are located. An elongated interconnect opening 36 in the package body20 connects the die mounting cavity 30 to the wire bonding cavity 32,and provides access for bonding the wires 34 to die contacts 38 on thedie 22. The wires 34 are also bonded to conductors 40 formed on thepackage body 20 in electrical communication with the ball contacts 26.

The component 14 also includes insulating layers 42 that electricallyinsulate the package body 20. In addition, a die encapsulant 44 fillsthe die mounting cavity 30 and encapsulates the die 22. A wireencapsulant 46 fills the wire bonding cavity 32 and encapsulates thewires 34.

Referring to FIG. 3A, the insert 16 and the substrate 12 are illustratedprior to separation of the substrate 12 into separate components 14. Theinsert 16 includes a base 48 and an adhesive layer 50. The base 48preferably comprises a rigid injection moldable plastic, but can alsocomprise a metal. Suitable plastics for the base 48 includethermoplastic plastics, thermosetting plastics and liquid crystalpolymers. Exemplary plastics include polyetherimide (PEI), polyphenylsulfide (PPS) and tetrafluoroethylene. The base 48 can also include acarbon filler or a metal layer (not shown) to provide electricalconductivity, and electrostatic discharge (ESD) protection for thecomponents 14.

The adhesive layer 50 can comprise an elastomeric material depositedonto the base 48 to a desired thickness. A representative thickness isfrom 0.25 mils to 3 mils. The adhesive layer 50 is adapted to adhesivelyretain the substrate 12 for dicing and then to retain the dicedcomponents 14.

Preferably, the adhesive layer 50 is formulated to provide adhesion butalso permits the diced components 14 to be easily separated from theadhesive layer 50. Exemplary elastomers for the adhesive layer 50include silicone gels, polysiloxanes, polyurethanes and acrylics.

The adhesive layer 50 can also comprise a pressure sensitive adhesive(PSA) such as an adhesive tape. The tape can include a polymer film andan adhesive layer formed thereon. One suitable tape is “KAPTON” tapemanufactured by DuPont. As will be further explained the adhesive layer50 can also be constructed as a vacuum actuated membrane.

As shown in FIG. 3A, the substrate 12 can be placed on the adhesivelayer 50 with the ball contacts 26 (FIG. 2A) facing away from theadhesive layer 50. Alternately, the substrate 12 can be placed on theadhesive layer 50 with the ball contacts 26 (FIG. 2A) on the components14 contacting the adhesive layer 50.

Referring to FIG. 3B, separation of the substrate 12 using aconventional semiconductor sawing process is illustrated. Semiconductorsawing is an abrasive process in which exposed diamond particles in sawblades 52 form the cutting edges. In FIG. 3C, the saw blade 52 has cutcompletely through the substrate 12 and the components 14 are separated.As also shown in FIG. 3C, the blade 52 has cut into the surface of theadhesive layer 50, but not into the base 48 of the insert 16. Athickness “T” of the blades 52 determines the separation distance “X”between the separated components 14. Representative values for thethickness “T” and separation distance “X” are from 1 mil to severalhundred mils. Rather than sawing, the substrate 12 can also be separatedusing another conventional process such as with a liquid jet stream, alaser, or a wet etchant.

Referring to FIGS. 4A-4C, an alternate embodiment vacuum actuated insert16A is illustrated. As shown in FIG. 4B, the insert 16A includes a base48A and an adhesive layer 50A. The base 48A includes sidewalls 104 and abottom wall 106 configured to form a vacuum chamber 94. The vacuumchamber 94 includes a vacuum opening 96 configured for flowcommunication with a vacuum source.

In the insert 16A, the adhesive layer 50A comprises a membrane that isstretched across the vacuum chamber 94 and attached to the base 48A withan adhesive 92. In addition, cylindrical support rods 100 are placed inthe vacuum chamber 94 and support the adhesive layer 50A. The adhesivelayer 50A can comprise a polymer film, such as polyimide, having anadhesive surface. Alternately, as shown in FIG. 4D, rather than rods 100(FIG. 4C), a woven material 110 having a warp and weft structure can beused to support the adhesive layer 50A.

In FIG. 4B, the substrate 12 is placed on the insert: 16A with the ballcontacts 26 on the components 14 touching the adhesive layer 50A.Alternately, the substrate 12 can be placed on the insert 16A with theball contacts 26 facing up. In either case, the adhesive layer 50Asupports the components 14 for separation along separation lines 102.Separating the components 14 can comprise sawing with blades 52 (FIG.3B) as previously described, or can be with a liquid jet stream, alaser, or a wet etchant.

Following separation of the substrate 12 into separate components 14,the insert 16A can be actuated by a vacuum flow 98 to release thecomponents 14 from the adhesive layer 50A. As shown in FIG. 4C, thevacuum flow 98 pulls the adhesive layer 50A onto surfaces of thecylindrical support rods 100 and away from the components 14. Inaddition, the vacuum flow 98 deforms a surface of the adhesive layer 50Aand separates the adhesive layer 50A from the components 14. This allowsthe components 14 to be easily removed from the adhesive layer 50A usinga tool, such as a vacuum handler (not shown). However, release of thecomponents 14 is not performed until the insert 16A has been mounted tothe carrier tray 18 and transported as will be further described.

Referring to FIG. 5, following separation of the substrate 12 intoseparate components 14, the inserts 16 (or 16A) with the separatedcomponents 14 thereon, are mounted to the carrier tray 18. As shown inFIG. 5A, the carrier tray 18 includes support members 54 for supportingthe bases 48 of the inserts 16. In addition, the carrier tray 18includes retention members 56 that engage edge portions 60 of the bases48 of the inserts 16. As shown in FIG. 5B, the carrier tray 18 includesclip members 58 that engage edge portions 62 of the bases 48 of theinserts 16. The clip members 58 can include a lip portion (not shown)that overlaps the edge portions 62 of the bases similarly to retentionmembers 56 (FIG. 5A).

In the illustrative embodiment, the carrier tray 18 is constructed toretain three inserts 16. However, depending on the size of the inserts16 and the carrier tray 18, other arrangements are possible. The inserts16 can be manually loaded into the carrier tray 18, or can be loadedwith a tool such as a vacuum handler. During loading, the inserts 16 canbe placed on the support members 54 of the carrier tray 18 such that theclip members 58 are initially compressed. The clip members 58 thenprovide a biasing force for pressing the edge portions 60 of the inserts16 against the retention members 56.

With the inserts 16 mounted to the carrier tray 18, standard equipmentsuch as magazines and conveyors, can be used to transport and handle thecarrier tray 18. During handling, the adhesive layers 50 on the inserts16 retain the components 14. In addition, the construction of the clipmembers 58 and retention members 56, prevents the inserts 16 fromseparating from the carrier tray 18, even with tipping and up side downmovement of the carrier tray 18.

For removing the inserts 16 from the carrier tray 18, the inserts 16 canbe slid along the support members 54 to compress the clip members 58,and disengage the retention members 56. The inserts 16 can then belifted out of the carrier tray 18. Removal of the inserts 16 can bemanually, or with a tool, such as a vacuum handler. A tool can also beslipped between the support members 54 to push the inserts 16 out of thecarrier tray 18.

Rather than removing the inserts 16 from the carrier tray 18 with thecomponents 14 thereon, the components 14 can be detached one at a timefrom the adhesive layer 50, while the inserts 16 remain mounted to thecarrier tray 18. For example, a vacuum tool can be used to remove thecomponents 14 from the inserts 16.

Referring to FIGS. 6-8, the carrier tray 18 is illustrated separately.The carrier tray 18 is a generally rectangular shaped member having alength L, a width W and a thickness t. The size and peripheral outlineof the carrier tray 18 are constructed according to standards of anindustry standard setting body, such as JEDEC (Joint Electron DeviceEngineering Council).

The carrier tray 18 includes parallel spaced side rails 64, 66 andparallel spaced end rails 68, 70. The carrier tray 18 also includesseparation ribs 108 that along with the side rails 64, 66 and end rails68, 70 define separate mounting areas for the inserts 16. These mountingareas have a peripheral outline that is slightly larger than aperipheral outline of the inserts 16. The separation ribs 108 extendbetween the side rails 64, 66 generally parallel to the end rails 68,70. Similarly, the support members 54 of the carrier tray 18 extendbetween the side rails 64, 66 generally parallel to the end rails 68,70. In addition, the retention members 56 of the carrier tray 18 areformed on side rail 64, and the clip members 58 are formed on side rail66.

The carrier tray 18 is designed for stacking with identical carriers oneither side. FIG. 9 illustrates a stack 78 of carrier trays 18-1, 18-2,18-3. Stacking ridges 72 are formed on a first side 74 (FIG. 7) of thecarrier tray 18. The stacking ridges 72 are molded integrally with theside rails 64, 66 and with the end rails 68, 70 The stacking ridges 72have an outer peripheral outline that corresponds in size and shape toan inner peripheral outline of the side rails 64, 66 and end rails 68,70 on an opposing second side 76 (FIG. 7) of the carrier tray 18.

The inserts 16 (FIG. 3A), or 16A (FIG. 4A), are sized such that whenmounted in the carrier tray 18, the separated components 14 (FIG. 2A) donot interfere with stacking. In addition, the separated components 14are enclosed, and physically protected, by the stacked carrier trays18-1, 18-2, 18-3. Cut outs 86 (FIG. 7) are formed in the side rails 64,66 to facilitate separation of the stacked carrier trays 18-1, 18-2,18-3.

The carrier tray 18 also includes a lug 80 on end rail 68, and a lug 82on end rail 70. As shown in FIG. 8, the lugs 80, 82 include indentations84. The lugs 80, 82 and indentations 84 have a standardizedconfiguration that permits handling of the carrier tray 18 by standardequipment.

The carrier tray 18 also includes a chamfered surface 88 formed on endrail 70. The chamfered surface 88 can be used to indicate an orientationof the carrier tray 18. A convex scallop 90 formed in side rail 64 canbe used for engaging a pin to mechanically bias orientation of thecarrier tray 18.

The clip members 58 are attached to an inner surface of side rail 66.The clip members 58 can comprise resilient metal or plastic springclips. The clip members 58 can be formed separately and then attached tothe side rail 66 with fasteners or adhesives. Alternately, the clipmembers 58 can be molded integrally with the side rail 66. The retentionmembers 56 can also be molded integrally with an inner surface of siderail 68.

As shown in FIG. 10, the support members 54 can also be moldedintegrally with the side rails 68, 70. In addition, a height H2 measuredbetween the surfaces of the support members 54 and upper surface of thesiderails 68, 70 is preferably equal to, or less than, a height H1 (FIG.3C) of the insert 16 and components 14.

Other than the clip members 58, the carrier tray 18 can be formed as aone piece plastic member using an injection molding process. Suitableplastics for the carrier tray 18 include thermoplastic plastics,thermosetting plastics and liquid crystal polymers. Exemplary plasticsinclude polyetherimide (PEI) and polyphenyl sulfide (PPS). The carriertray 18 can also include a carbon filler, or a metal layer (not shown)to provide electrical conductivity, and electrostatic discharge (ESD)protection for the components 14.

Referring to FIG. 11, broad steps in a method for dicing the substrate12 in accordance with the invention are illustrated.

1. Providing a substrate 12 having multiple semiconductor components 14.

In the illustrative embodiment the substrate 12 comprises silicon, andthe components 14 (FIG. 2A) comprise chip scale packages.

2. Providing an insert 16 (or 16A) configured to retain the substrate 12for separation into separate components 14.

As shown in FIG. 3A, the insert 16 includes a base 48 with an adhesivelayer 50 formed thereon. Alternately, as shown in FIG. 4B, the insert16A includes an adhesive layer 50A formed as a vacuum displaceablemembrane.

3. Providing a carrier tray 18 configured to retain one or more inserts16 (or 16A).

As shown in FIG. 5, the carrier tray 18 includes retention members 56and clip members 58. In addition, a peripheral configuration of thecarrier tray 18 is standardized, and other features (e.g., lugs 80, 82)are standardized, to permit handling by standardized equipment.

4. Placing the substrate 12 on the insert 16.

FIG. 3A illustrates the placing step.

5. Separating the substrate 12 into separate components 14.

FIG. 3B, illustrates the separating step using saw blades 52. During theseparating step the substrate 12 and separated components 14 areretained by the insert 16.

6. Mounting the insert 16 with the separate components 14 thereon to thecarrier tray 18.

FIG. 5 illustrates three inserts 12 mounted to the carrier tray 18. Theretention members 56 and clip members 58 retain the inserts on thecarrier tray 18 even with movement and tipping of the carrier tray 18.

7. Transporting and handling the carrier tray 18 with the insert 12mounted thereto using standardized equipment.

The transporting step can include stacking multiple carrier trays 18 asshown in FIG. 9.

8. Following transporting and handling, removing the insert 16 from thecarrier tray 18.

The insert 16 can be removed from the carrier tray 18 with the separatecomponents 14 retained thereon.

9. Removing separate components 14 from insert 16.

The removing step can be accomplished with a vacuum tool or similarmethod. FIG. 4C illustrates vacuum actuation of insert 16A for removingthe components 14. Alternately, the separate components 14 can beremoved as the insert 16 (or 16A) remains attached to the carrier tray18.

Thus the invention provides an improved method and system for dicingsemiconductor components. While the invention has been described withreference to certain preferred embodiments, as will be apparent to thoseskilled in the art, certain changes and modifications can be madewithout departing from the scope of the invention as defined by thefollowing claims.

What is claimed is:
 1. A system for dicing a substrate comprising aplurality of semiconductor components comprising: an insert comprising abase, and an adhesive or a vacuum membrane on the base configured toretain the substrate on the base for separation into the components, andto retain the components on the base following separation; and a carrierconfigured to hold the insert with the components thereon, the carriercomprising at least one retention member configured to retain the inserton the carrier, and a plurality of different features configured tofacilitate transport and handling of the carrier.
 2. The system of claim1 wherein the adhesive comprises a double sided tape or an adhesivelayer.
 3. The system of claim 1 wherein the carrier is configured toretain a plurality of inserts.
 4. A system for dicing a substratecomprising a plurality of semiconductor components comprising: a baseconfigured to support the substrate; an adhesive member on the baseconfigured to retain the substrate on the base for separation into thecomponents and to retain the components on the base followingseparation; and a carrier configured to retain the base with thecomponents thereon, the carrier comprising a plurality of featuresincluding an outline, a lug, a chamfer and a stacking ridge, configuredto facilitate handling or transporting of the carrier with the base andthe components thereon.
 5. The system of claim 4 wherein the carrierfurther comprises a retention member configured to retain the base onthe carrier.
 6. The system of claim 4 wherein the lug is configured toengage a conveyor.
 7. The system of claim 4 wherein the chamfer isconfigured to indicate an orientation of the carrier.
 8. The system ofclaim 4 wherein the stacking ridge is configured to stack the carrier toa second carrier substantially identical to the carrier.
 9. A system fordicing a substrate comprising a plurality of semiconductor componentscomprising: a base configured to support the substrate; a vacuum chamberon the base; a membrane on the vacuum chamber configured to retain thesubstrate on the base for separation into the components and to retainthe components following separation on the base, the membrane configuredto deform upon application of a vacuum to the vacuum chamber forremoving the components from the base; and a carrier configured toretain the base with the components thereon, the carrier comprising aplurality of features including an outline, a lug, a chamfer and astacking ridge configured to facilitate handling and transporting of thecarrier with the base and the components thereon.
 10. The system ofclaim 9 further comprising at least one retention member on the carrierconfigured to retain the base on the carrier.
 11. The system of claim 9wherein the lug is configured to engage a conveyor.
 12. The system ofclaim 9 wherein the chamfer is configured to indicate an orientation ofthe carrier.
 13. The system of claim 9 wherein the stacking ridge isconfigured to stack the carrier to a second carrier substantiallyidentical to the carrier.
 14. The system of claim 9 wherein the carriercomprises a plurality of retention members configured to retain aplurality of bases.
 15. A method for dicing a substrate comprising aplurality of semiconductor components comprising: providing a basecomprising an adhesive configured to retain the substrate on the base;providing a carrier comprising at least one retention member configuredto retain the base on the carrier and a plurality of different featuresconfigured to facilitate transport or handling of the carrier, the atleast one retention member comprising a lip configured to engage an edgeof the base and a clip configured to bias the base against the lip;separating the substrate into the components with the substrate retainedon the base during separation, and the components retained on the basefollowing separation; and handling or transporting the carrier with thebase retained on the carrier and the components retained on the base.16. The method of claim 15 wherein the features include an outline, alug, a chamfer and a stacking ridge.
 17. The method of claim 15 whereinthe adhesive comprises an adhesive layer or a double sided tape.
 18. Themethod of claim 15 wherein the carrier is configured to retain aplurality of bases substantially identical to the base.
 19. The methodof claim 15 wherein the separating step is performed with a saw, aliquid jet stream, a laser or an etchant.
 20. A method for dicing asubstrate comprising a plurality of semiconductor components comprising:providing a base comprising an adhesive or a vacuum membrane configuredto retain the substrate on the base; separating the substrate into thecomponents with the substrate retained on the base during separation andthe components retained on the base following separation; providing acarrier comprising a lip configured to engage an edge of the base toretain the base on the carrier and a clip configured to bias the baseagainst the lip, the carrier further comprising a plurality of featuresconfigured to facilitate handling and transport of the carrier, thefeatures comprising an outline, a lug, a chamfer and a stacking ridge;and handling or transporting the carrier with the base retained on thecarrier and the components retained on the base.
 21. The method of claim20 wherein the adhesive comprises an adhesive layer or a double sidedtape.
 22. The method of claim 20 wherein the carrier is configured toretain a plurality of bases for transport and handling.
 23. The methodof claim 20 wherein the separating step is performed with a saw, aliquid jet stream, a laser or an etchant.
 24. The method of claim 23wherein the lug is configured to engage a conveyor.
 25. The method ofclaim 23 wherein the chamfer is configured to indicate an orientation ofthe carrier.
 26. The method of claim 23 wherein the stacking ridge isconfigured for stacking the carrier to a second carrier substantiallyidentical to the carrier.